Normally an automatic pick and place machine is used because the numbers of components used these days and the accuracy required make manual placement non-viable. With the solder paste on the board the components can then be set in place. Once added the solder paste has been added to the board, it can move on to the next stage. This only allows the solder paste to be added to those areas of the board where it is needed. This is achieved by having a solder mask and solder paste "machine". While boards have solder resist layers added to them, it is necessary to only add solder paste to those areas where the solder is actually required. The paste is only applied to the areas that require soldering. In essence solder paste is applied to the board. These stages are covered in more detail in a separate page on this section of the website. The first stage in reflow soldering for PCB assembly is to apply solder paste and components to the board. If you want to order PCB product, please check and custom your order online.ġ. If you are looking for the information of PCB reflow soldering, please check and read the contents for more professional knowledge. And it’s the best for use with components used in mass produced electronics products. Reflow soldering technology, making it possible to reliably solder surface mount components, especially the components with very fine pitch leads. What’s more, heating can be done by passing the assembly with the reflow oven as well as under an infrared lamp or by soldering individual joints with a desoldering hot air pencil. The solder paste reflows in a molten stage to create the permanent solder joints. Reflow soldering is a process, which using the solder paste to connect one or thousands of tiny electrical components to their contact pads, and then it will control the whole assembly by heating.
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